Shanghai Huitian New Material Co., Ltd
Created with Pixso.
kutipan
Created with Pixso. Rumah > Produk >
Perekat Elektronik
>

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc.

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc.

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc.

Rincian Produk:
Place of Origin: CHINA
Nama merek: HUITIAN
Sertifikasi: RoHS REACH
Model Number: 5292
Informasi detil
Place of Origin:
CHINA
Nama merek:
HUITIAN
Sertifikasi:
RoHS REACH
Model Number:
5292
Physical Form:
Paste
Color Part A:
Gray fluid
Color Part B:
White fluid
Viscosity Part A:
8,000~14,000 mPa·s
Viscosity Part B:
70,00~13,000 mPa·s
Mixing Ratio:
1:1
Opearting Time @25 °C:
≥60
Curing Time @80℃:
≤30 mins
Hardness (Shore A):
20-45
Volume resistivity:
1.0*10^12 Ω∙cm
Dielectric strength:
≥14 KV/mm
Thermal Conductivity:
2.4-2.6 W/(m•K)
Informasi Perdagangan
Minimum Order Quantity:
200 kg
Harga:
Dapat dinegosiasikan
Packaging Details:
20kg/barrel
Delivery Time:
5-8 days
Payment Terms:
L/C,T/T
Supply Ability:
2000T/Month
Deskripsi Produk

Huitian® 5292 Two-Part Addition-Type Potting Material: Advanced Solution for Electronic Encapsulation


Product Description

5292 is a high-performance two-part addition-type potting silicone rubber designed for critical electronic and electrical applications. With a 1:1 mixing ratio by weight, this adhesive offers exceptional versatility, curing at room temperature or through heat acceleration, making it ideal for demanding environments that require reliable insulation, thermal management, and mechanical protection.


Product Applications
5292 is widely used in:
Electronic & Electrical Components: Potting of inverters, military power supplies, communication power supplies, and instrumentation components.
Industrial Equipment: Protection against moisture, fouling, corrosion, vibration, and electrical interference.
PCB & Metal Substrates: Bonding and sealing for glass, PCBs, aluminum, and other materials without the need for a primer.


Key Product Features 
High Thermal Conductivity: Achieves 2.4–2.6 W/m·K (ASTM D5470), ensuring efficient heat dissipation for components.
Flame Retardancy: Meets UL94V-0 standards, providing enhanced safety in high-temperature applications.
Dual Curing Mechanism: Cures at room temperature or speeds up with heat (e.g., ≤30 min at 80°C), suitable for various production schedules.
Excellent Insulation: Volume resistivity ≥1×10¹² Ω·cm and dielectric strength ≥14 kV/mm, ensuring reliable electrical isolation.
Wide Temperature Resistance: Maintains rubber elasticity from -40°C to 200°C, suitable for extreme environmental conditions.
Superior Weather & Aging Resistance: Withstands harsh climates and prolonged use without degradation.
Primer-Free Bonding: Adheres directly to glass, PCBs, aluminum, and other substrates, simplifying application.
User-Friendly Operation: Operating time ≥60 min at 25°C allows for precise handling and defoaming.


Technical Parameters

Reference standard

Item

Unit

Value

Physical properties before curing (25±2℃, 60%±5%RH)

Q/HTXC 2

Appearance (A)

--

Gray fluid

 

Appearance (B)

--

White fluid

GB/T2794

Viscosity (A)

mPa·s

8,000~14,000

 

Viscosity (B)

mPa·s

70,00~13,000

GB/T2794

Mix viscosity(1:1)

mPa·s

8,000~14,000

Physical properties after curing (25±2℃, 60±5%RH, A:B=1:1)

Q/HTXC 2

Operating time (25℃)

min

60

Q/HTXC 2

Cure time (80℃)

min

30

GB/T 2411

Density

g/cm3

2.7-3.0

GB/T 4509

Hardness

Shore A

20-45

GB/T 1695

Dielectric strength

KV/mm

14

GB/T 1692

Volume resistivity

Ω·cm

1×1012

ASTM D5470

Thermal conductivity

W/m·K

2.4-2.6

ISO 22007

Thermal conductivity

W/m·K

≥2.3


Directions for Use
Preparation: Stir Components A and B thoroughly (manually or mechanically) to prevent performance issues from filler settlement.
Mixing: Weigh components accurately at a 1:1 ratio, combine in a clean container, and stir until homogeneous.
Defoaming: Apply vacuum (0.08–0.1 MPa) for 10–20 min to remove air bubbles before potting.
Potting: Ensure application surfaces are clean and dry. Pot while the adhesive is still fluid to avoid leveling issues.
Curing:
Room Temperature: Cure naturally (accelerated by higher temperatures).
Heat Curing: Recommended in winter; cure at 80°C for ≤30 min.


Packaging & Storage Conditions
Packaging:
part A (5292 A8): 20 kg/barrel
Part B (5292 B8): 20 kg/barrel
Storage: Store in a cool, dry place at 8–28°C, sealed to prevent contamination.
Shelf Life: 6 months when stored as directed.


5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc. 0

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc. 1

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc. 2

5292 Two-Part 1:1 Gray Addition-Type Potting Material,Thermal Conductivity 2.4-2.6W/m·K, UL94V-0 For Potting Inverters, Military & Communication Power Supplier, Etc. 3

Tag:

Created with Pixso.
unduh Created with Pixso.